IC & Module Reliability Engineer

Job Description
This client are pioneers in the future of Satellite Communication. They are searching for an IC Reliability engineer to join their team in Edinburgh. You will play a crucial role in ensuring the reliability, performance, and safety of our products at multiple levels of the manufacturing process is proven through defined, industry standard semiconductor and satellite communication product qualification programs.
Key tasks:
Conduct reliability testing and analyses to identify failure points at IC, IC package, Module and Motherboard level.
Develop and execute reliability test plans for semiconductor devices, including stress testing, accelerated life testing, and environmental testing.
Implement and maintain reliability modelling and prediction tools to assess the long-term performance of semiconductor devices.
Investigate root causes of failures, analyse failure data, and make recommendations to enhance product reliability.
Interpret customer qualification requirements and support all new product qualification proposals.
Develop and maintain reliability models, metrics, and documentation to support product development and reliability improvement efforts.
Contribute to the development of reliability documentation, including reliability plans, reports, and specifications.
Work closely with cross-functional teams, including design, process engineering, and quality assurance, to integrate reliability considerations into the product development process.
Conduct risk assessments, including Failure Mode and Effects Analysis (FMEA), to proactively identify potential failure modes and mitigation strategies.
Ideal Background:
Experience in applying reliability tools and methodologies, such as Weibull analysis, accelerated life testing, reliability prediction, and root cause analysis.
Deep experience of IC level reliability testing.
Previous experience of executing reliability programs for new products both internally and within an OSAT environment.
Expert knowledge of packaging reliability requirements for THB, HAST, HTOL, ELFR etc.
Advanced knowledge of packaging failure analysis techniques such as Ball Shear, Die Shear, CSAM and X-Ray.
Solid understanding of semiconductor device physics, fabrication processes, and packaging technologies.
Excellent communication and interpersonal skills to effectively collaborate with cross-functional teams and stakeholders.
Excellent time management skills and able to work to tight and dynamic time scales.
Experience of working in a product development team.
Strong analytical skills with ability to articulate results to a wider audience.
Detail-oriented mindset with a focus on quality and continuous improvement.
Nice to Have:
Knowledge of industry standards and regulations related to reliability and safety (e.g., ISO ).
Proficiency in reliability modelling tools and techniques (e.g., Weibull analysis, reliability block diagrams).
Knowledge of MEMS reliability techniques.
Working knowledge of JMP or similar analysis tools.
Experience of conducting DOE (Design of Experiment) Understanding of a multistage production flows with multiple packing requirements within the flow.
Understanding of a multistage production flows with multiple packing requirements within the flow.
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